Density (25 ℃) : 1.065 - 1.075 g/cm³

Boiling point : 262 ℃

Flash point : 122 ℃

Appearance : Colorless transparent liquid

Dissolvability : Be soluble in water, and a hydrolysis reaction will occur at the same time, during which will release methanol. Be soluble in alcohol and acetone, and also be soluble in most of aliphatic esters in the case of normal usage under 5%.

This material can seal, bond, and reinforce thermosetting and epoxy resin, fiberglass, and thermoplastic resin with inorganic filling or glass reinforcement.

Enhance strength of composite materials with fiberglass yarn and maintain performance after conditioning.

To improve electrical properties of epoxy resin-based electronic sealants and encapsulation materials, enhance resin-substrate or resin-filler adhesion.

Enhance electrical properties of nylon and polybutylene terephthalate composites using inorganic fillers.

Aluminum, copper, and iron are versatile fillers and matrices for various materials, including clay, talc, limestone, silica, quartz, and metal oxides.

Improving the compatibility, dispersibility, and flowability of binders in organic colorants.